PESD0603-240【PDF 4/6 页】ESD PROTECTOR 0603 24VDC POLYMER

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Table E4 General Characteristics for ESD Devices

Storage temperature

Operating temperature

ESD voltage capability

(tested per IEC 61000-4-2)

ESD pulse withstand

-40°C to +85°C

-55°C to +125°C

Contact discharge mode : 8kV (typical), 15kV (max)

Air discharge mode : 15kV (typical), 25kV (max) [1 pulse: per customer request]

100 pulses

(tested per IEC 61000-4-2, level 4,contact method)

Table E5 Materials Information for ESD Devices

RoHS compliant

ELV compliant

Halogen free

Directive 2002/95/EC compliant

Directive 2000/53/EC compliant

Halogen free refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm

Table E6 Recommended Pad Layout for ESD Devices in Millimeters (Inches)*

V

W

X

Y

Z

Part Number

PESD0402-140

Min.

—

Max.

—

Min.

0.60

Max.

0.70

Min.

0.30

Max.

0.40

Min.

0.80

Max.

0.90

Min.

2.10

Max.

2.20

Figure

E8

(0.024)

(0.028)

(0.012)

(0.016)

(0.031)

(0.035)

(0.083)

(0.087)

PESD0603-240

—

—

0.90

1.00

0.50

0.60

1.00

1.10

2.70

2.80

E8

(0.035)

(0.039)

(0.020)

(0.024)

(0.039)

(0.043)

(0.106)

(0.110)

V

W

X

Y

Z

9

Part Number

PESD1206Q-240

Typ.

3.20

Typ.

2.20

Typ.

0.50

Typ.

0.80

Typ.

1.00

Figure

E9

(0.126)

(0.087)

(0.020)

(0.031)

(0.039)

*The dimensions in inches are rounded approximations.

Figure E8

X

Figure E9

V

W

Z W

Y

Z

X

Y

Note: Solder thickness 0.15 to 0.2 mm

Table E7 Solder Reflow Recommendations for ESD Devices

A Temperature ramp up 1

From ambient to preheating

30s to 60s

Figure E10

B Preheating

C Temperature ramp up 2

temperature

140°C - 160°C

From preheating to main

60s to 120s

20s to 40s

300

250

200

Preheating

Soldering

Cooling

heating temperature

150

D Main heating

at 200°C

at 220°C

60s to 70s

50s to 60s

100

50

at 240°C

at 260°C

30s to 40s

5s to 10s

0

A

B

C

D

E

E

Cooling

From main heating

4°C/s max

Times (s)

temperature to 100°C

60

RoHS Compliant, ELV Compliant

HF Halogen Free

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